图片 | 型号 | 品牌 | 分类名称 | 封装 | 描述 | 价格 | 数据手册 |
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SI32260-C-FM1R | SILICON LABS(芯科) | 电信接口IC | QFN-60 | SI32260-C-FM1R | ¥24.256 |
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SI32260-C-FM2R | SILICON LABS(芯科) | 电信接口IC | QFN-60 | SI32260-C-FM2R | ¥26.785 |
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SI32919-A-FSR | SILICON LABS(芯科) | 电信接口IC | SOIC | SI32919-A-FSR | ¥15.331 |
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BCM84756CKFSBLG | Broadcom/AVAGO(安华高) | 电信接口IC | - | BCM84756CKFSBLG | ¥230.183 |
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BCM84754A1KFSBLG | Broadcom/AVAGO(安华高) | 电信接口IC | - | BCM84754A1KFSBLG | ¥663.112 |
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HC9P5504B-5 | HARRIS(哈利斯) | 电信接口IC | SOIC-24 | HC9P5504B-5 | ¥26.285 |
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HC55121IM | HARRIS(哈利斯) | 电信接口IC | PLCC-28(11.51x11.51) | HC55121IM | ¥14.005 |
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HC5526CM | XICOR | 电信接口IC | PLCC-28(11.51x11.51) | HC5526CM | ¥8.864 |
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HC55140IM | HARRIS(哈利斯) | 电信接口IC | PLCC-28(11.51x11.51) | HC55140IM | ¥19.696 |
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HC55182DIM | HARRIS(哈利斯) | 电信接口IC | PLCC-28(11.51x11.51) | HC55182DIM | ¥8.435 |
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HC9P5509B3999-003 | XICOR | 电信接口IC | SOIC-28-300mil | HC9P5509B3999-003 | ¥8.354 |
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HC55185GCM | HARRIS(哈利斯) | 电信接口IC | PLCC-28(11.51x11.51) | HC55185GCM | ¥16.004 |
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HC9P5509B3999-003 | HARRIS(哈利斯) | 电信接口IC | - | HC9P5509B3999-003 | ¥8.354 |
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HC3-5502B-5 | XICOR | 电信接口IC | - | HC3-5502B-5 | ¥7.762 |
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HC5526CM | HARRIS(哈利斯) | 电信接口IC | PLCC-28(11.51x11.51) | HC5526CM | ¥8.864 |
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HC55142IM | XICOR | 电信接口IC | PLCC-28(11.51x11.51) | HC55142IM | ¥10.169 |
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HC55185FCM | XICOR | 电信接口IC | PLCC-28(11.51x11.51) | HC55185FCM | ¥6.477 |
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HC55185FCM | HARRIS(哈利斯) | 电信接口IC | PLCC-28(11.51x11.51) | HC55185FCM | ¥6.477 |
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HC5515CM | XICOR | 电信接口IC | PLCC-28(11.51x11.51) | HC5515CM | ¥6.967 |
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HC5526CP | HARRIS(哈利斯) | 电信接口IC | PDIP-22 | HC5526CP | ¥9.823 |
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